Dithiazole Diamine Impurity - Request Quote
Dithiazole Diamine Impurity
| SZ CAT No: | SZ-C088017 |
| CAS No | NA |
| Mol.F. | C28H30N4O4S2 |
| Mol.Wt. | 550.7 |
| Inv. Status | Synthesis on demand |
Chemical Name :
Shipping Temperature :
HSN Code :
Country of Origin :
Smiles :
Usage Note:
Dithiazole Diamine Impurity is chemically Bis(thiazol-5-ylmethyl) ((2S,5S)-1,6-diphenylhexane-2,5-diyl)dicarbamate. Dithiazole Diamine Impurity is supplied with detailed characterization data compliant with regulatory guideline. Dithiazole Diamine Impurity can be used for the analytical method development, method validation (AMV), Quality Controlled (QC) application for Abbreviated New Drug Application (ANDA) or during commercial production of Cobicistat.
The product can be used as reference standards and further traceability against pharmacopeial standards (USP or EP) can be provided based on feasibility. SynZeal products are for analytical purpose only and not for human use.
Applications & Regulatory Use Cases
buy high quality Dithiazole Diamine Impurity
Purchase Dithiazole Diamine Impurity
Dithiazole Diamine Impurity suppliers
Dithiazole Diamine Impurity manufacturers
Dithiazole Diamine Impurity price
Order Dithiazole Diamine Impurity
Enquire Dithiazole Diamine Impurity
Dithiazole Diamine Impurity cost
Dithiazole Diamine Impurity Supplier
Dithiazole Diamine Impurity Distributor
Dithiazole Diamine Impurity for Method Validation
Cobicistat Reference Standard
Dithiazole Diamine Impurity for ANDA Filing
Dithiazole Diamine Impurity for Forced Degradation Studies
Dithiazole Diamine Impurity Identification Standards
Dithiazole Diamine Impurity for DMF Filing
Related Products
Disclaimer
SynZeal product information given on this website is as per the existing understanding while publishing the details on website. The customer is responsible for assessing the accuracy of the information at the time of actual purchase.
SynZeal will update these details as per new developments or findings in product specifications without further notice.


